Component & Material Testing

Component & Material Testing

AVRGT global materials / sourcing team provides manufacturing support and product development assistance for the electronics and semiconductor industry.  IC, Active Component, Micro-electronics products can be more difficult to supply-chain source, design, manufacture, and troubleshoot. 


AVRGT is your supply chain partner for product electronic component testing to confirm quality,  with test and inspection tools such as; FIB FESEM and nondestructive electronic component testing techniques; X-Ray, 3D X-Ray CT, and C-SAM including failure analysis of semiconductor devices. 

 AVRGT is positioned to assist with your project from all phases of the electronics industry pipeline – from fab-less design engineering groups supported with semiconductor package failure analysis through photo or e-beam lithography process troubleshooting or board level component assembly and OEM manufacturing (and Contract Manufacturing - CM). 

 

We support the sourcing of all types of electronic components:

 

·       Integrated Circuits

·       Dielectrics

·       Printed Circuit Board Assemblies (PCBA)

·       MEMS Devices

 ·       Through-hole and SMC Electronic Components

·       Packaging Materials

·       Molded Parts

·       Cables & Connectors

                   

                          Contact the AVR Global Technologies, Inc Engineer team for support.

   

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